PVD (Physical Vapor Deposition)
Evaporator
- Thermal Evaporator
- E-beam Evaporator
- Ion Beam Assisted Deposition
- Arc Suppression E-beam Evaporator
- Pulsed Laser Deposition
Sputter
- RF & DC Magnetron
- Ion Beam Sputter
- UHV Sputter
- In Line Sputter
- Bench Top Sputter
Solar Cell
• CVD (Chemical Vapor Deposition)
PECVD
RTP (Rapid Thermal Process)
• Etcher
ICP (Inductively Coupled Plasma)
RIE (Reactive Ion Etching)
CAIBE (Chemically
   Assisted Ion Beam Etching)
Atmospheric Plasma
Vacuum Dryer
 
 
home > product > PVD (Physical Vapor Deposition) > evaporator
A evaporator uses an electric resistance heater or high-energy beam to melt the material and
raise its vapor pressure to a useful range. This is done in a high vacuum, both to allow
the vapor to reach the substrate without reacting with or scattering against other gas-phase
atoms in the chamber, and reduce the incorporation of impurities of from the residual gas
in the vacuum chamber. Our evaporation system is capable of fabricating multi-layer
thin films by applying co-deposition system. Also, Arc-suppression E-beam Evaporator can be
operated at the pressure of 5x10-3 Torr and up.