PVD (Physical Vapor Deposition)
Evaporator
- Thermal Evaporator
- E-beam Evaporator
- Ion Beam Assisted Deposition
- Arc Suppression E-beam Evaporator
- Pulsed Laser Deposition
Sputter
- RF & DC Magnetron
- Ion Beam Sputter
- UHV Sputter
- In Line Sputter
- Bench Top Sputter
Solar Cell
• CVD (Chemical Vapor Deposition)
PECVD
RTP (Rapid Thermal Process)
• Etcher
ICP (Inductively Coupled Plasma)
RIE (Reactive Ion Etching)
CAIBE (Chemically
   Assisted Ion Beam Etching)
Atmospheric Plasma
Vacuum Dryer
 
 
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RMV series
Introduction
The Rocky Mountain Vacuum Tech, Inc. Vacuum Dryer System offers uniform thermal control over large volumes at high temperatures. This system utilizes a specially designed array of heating elements with closed loop control to provide absolute temperature uniformity. Heat conduction, coupled between the heating elements and the material to be processed, is employed under vacuum conditions to provide ultimate drying capability within a minimal amount of time.
In this two step process, the material to be dried is first heated under atmospheric conditions utilizing a circulating fan.
When the material reaches a pre-set temperature, the vacuum system is employed to assist drying and cleaning operations.
The Rocky Mountain Vacuum Tech, Inc. Vacuum Dryer System provides total temperature and vacuum control for drying advanced electronic products, metals, plastics, etc. It is ideally suited for removing contaminants such as oil, dust and water vapor.
 

Features

- High drying rate
- Easy maintenance reduces down time.
- Available for various sample sizes
- Low system and operating costs.
- Pumping, transfer and processing are controlled completely automatically through recipe
  by operation from the touch display panel.

Application

- Drying process for the manufacturing the flat panel display such as LCD, PDP
- The removal of moisture, particles, and dust after coating material
  in FPD manufacture using Heating & Pumping
- The cleaning of sample by heating and setting plasma source
- Safekeeping of sample & holder by proper heating in dry chamber after depositing MgO

Specification

Process Chamber Size : 1000(W) X 1000(D) X 2000(H) – Variable
Pumping System Rotary Pump & Booster Pump
Temp. Range 200°C (Room Temp.)
Heating Elements Sheathe Heater
Temp. Control PID Controller
Speed control Variable with DC geared Motor
Sample Transfer Using roller in the process chamber, Conveyor Unit for
Sample loading & unloading