Feature
- Ion-beam Sputtering
: permits independent control over the energy
and the current density of the bombarding ions.
- Ion beam sources
: permits sputtered coatings to be deposited
at very low inert working-gas pressure (10-4 Torr)
onto substrates that are not in contact with a plasma.
- Good film thickness uniformity
: good film thickness uniformity even with targets
of the same diameter as the substrate.
- Low-pressure process
: Can maintain discharge at the range of pressure of about
10<sup>-4</sup> Torr, roughly one order of magnitude lower
than the conventional sputter discharge pressure. |
