Excellent Thickness Uniformity
The RF and DC Sputtering System from Rocky Mountain Vacuum Tech, Inc. provides excellent thickness uniformity of
resultant films even for substrates that are the same diameter as the sputtering cathode assembly.
Low-pressure Process
It is possible to maintain a plasma discharge even at pressures as low as 10^-2 Torr, (approximately one order of
magnitude lower than that of conventional sputter discharge systems).
Precise Control
A differentially variable speed control rotating substrate carrier provides for continuity and homogeneity of resultant films.
Multi-Layer Deposition
Multiple cathode assemblies provide for either sequential multi layer or complex alloy deposition In situ.
High Rate Deposition with Excellent Run-to-Run Reproducibility
These systems provide for high sputter yields for all deposition materials with excellent heat transfer
properties to the substrate.
They are capable of both RF and DC deposition.