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Sputter deposition is a technique used to deposit thin films of a material onto a surface(substrate).
sputtering is driven by momentum exchange between the ions and atoms in the material,
due to collisions[1][2]. The incidentions set off collision cascades in the target.
When such cascades recoil and reach the target surface with an energy above the surface
binding energy, an atom can be ejected. If the target is thin on an atomic scale the collision cascade
can reach the back side of the target and atoms can escape the surface binding energy `in transmission'.
The average number of atoms ejected from the target per incident ion is called the sputter yield
and depends on the ion incident angle, the energy of the ion, the masses of the ion and target atoms,
and the surface binding energy of atoms in the target. |
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