Automatic pumping and process control
Arc-suppression multi-pocket e-beam source with power supply
Precise control of deposition rate
Low ultimate vacuum pressure 10E-8 Torr range with cryogenic pump
Quartz halogen lamp heating
Advantages
- Advanced pumping system
- Ease of maintenance
(removable shields preventing chamber wall deposition)
- Capable of operating at pressures greater than 5x10-3 Torr
- Suitable for reactive gas deposition
(O2, N2) due to arc suppression capability
- Eliminates the need for reactive
substrate treatment with ion sources
- Large capacity chamber for multiple
or large area substrates
- Excellent film thickness uniformity
with good adhesive characteristics
(greater than ±5% uniformity across
a 3" dia. wafer)
- Excellent run-to-run uniformity and
lot-to-lot reproducibility
Application Transparent Conductive Coatings (ITO deposition)
Ohmic contact layers such as III-V semiconductor
GaN based LED
Optical Coatings ( lens, mirror, and anti reflection)
Flat Panel Display (LCD, PDP and OLED)
