PVD (Physical Vapor Deposition)
Evaporator
- Thermal Evaporator
- E-beam Evaporator
- Ion Beam Assisted Deposition
- Arc Suppression E-beam Evaporator
- Pulsed Laser Deposition
Sputter
- RF & DC Magnetron
- Ion Beam Sputter
- UHV Sputter
- In Line Sputter
- Bench Top Sputter
Solar Cell
• CVD (Chemical Vapor Deposition)
PECVD
RTP (Rapid Thermal Process)
• Etcher
ICP (Inductively Coupled Plasma)
RIE (Reactive Ion Etching)
CAIBE (Chemically
   Assisted Ion Beam Etching)
Atmospheric Plasma
Vacuum Dryer
 
 
home > product > PVD (Physical Vapor Deposition) > evaporator > Ion Beam Assisted Deposition
RME series
Feature
- Higher degree of efficiency in deposition
- Improvement in hardness and scratch resistance
- Enhanced uniformity
- No need for glow discharge or additional heating
- Decrease in thermal loading during progress
- Usage of various gases

Specification

Ultimate pressure Less than 2x10-7 Torr
Sample Size 4” to 8”
Substrate size 4” to 8”
Uniformity Within ±3%
System constitution deposition chamber
Substrate heater Maximum 800°C
Technical Description
The ITO thin films deposited can be applied to the low temperature substrates
such as Vinyl and polycarbonate, which are required for the next generation display
devices, since these substrates are quite lighter than conventional glass substrates.