PVD (Physical Vapor Deposition)
Evaporator
- Thermal Evaporator
- E-beam Evaporator
- Ion Beam Assisted Deposition
- Arc Suppression E-beam Evaporator
- Pulsed Laser Deposition
Sputter
- RF & DC Magnetron
- Ion Beam Sputter
- UHV Sputter
- In Line Sputter
- Bench Top Sputter
Solar Cell
• CVD (Chemical Vapor Deposition)
PECVD
RTP (Rapid Thermal Process)
• Etcher
ICP (Inductively Coupled Plasma)
RIE (Reactive Ion Etching)
CAIBE (Chemically
   Assisted Ion Beam Etching)
Atmospheric Plasma
Vacuum Dryer
 
 
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RME series  

RME-E2000 series

RME-E2000L series
Feature
- High vacuum compatible to 10E-7 Torr
- Mechanical dry pump and Cryogenic
  high vacuum pump
- High deposition rate
- High precision deposition rate control
- Multi-layer deposition
- Prevention of source-oxidation and sample
  contamination because the process chamber
  is always maintained under high vacuum conditions
  to facilitate quick cycle times.
Specification

Model RME-E2000L Series RME-E2000 Series
Process Chamber Material : sus 304
Chamber wall electro-polishing
Pumping Station Rotary pump & Tubor molecular pump or
Cryogenic pump
Evaporation Source Electron beam & Power supply
(Telemark Brand)
Substrate Type Rotation (Standard)
Deposition Control 6MHz QCM cotroller 6MHz QCM Monitor
(Controller Option)
Procss Control PLC based PC control PLC touch panel
(Labview software) (Semi-Auto)
Optional Substrate Carriers
1. Hemispherical Dome
  - Single Planetary Dome : 42 pc's 2" dia. wafers
  - Three Planatary Domes : 108 pc's 2" dia. wafers
                                              24 pc's 4" dia. wafers
2. Substrate Cooling
3. Substrate Heating
4. Planetary Substrate Carrier
   (Revolving and Rotating)