| Feature |
- Excellent film thickness uniformity
Excellent thin film uniformity and temperature control
- Vacuum compatible to 10-7 Torr
- Substrate heating – halogen lamp heater
- Substrate transfer mechanism
- Multi-layer and/or co-deposition processing
- Glove box and encapsulation module |
Specification
| Ultimate pressure |
Less than 2x10-7 Torr |
| Source |
RME-T4000LG |
Organic |
| RME-T2000 |
Metal |
| Sample Size |
2~8 inches |
| Substrate size |
2~8 inches dia. with wafer tray |
| Uniformity |
Within ±3% |
| System constitution |
Load lock & deposition chamber |
| Substrate heater |
300 degree C |
|
| Optional Substrate Carriers: |
1. Hemispherical Dome
- Single Planetary Dome : 42 pc's 2" dia. wafers
- Three Planatary Domes : 108 pc's 2" dia. wafers
24 pc's 4" dia. wafers
2. Substrate Cooling
3. Substrate Heating
4. Planetary Substrate Carrier (Revolving and Rotating) |
|
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